Hi Al -- The resolution is impressive. It was made using a 600dpi printer. He used mostly surface-mount parts with a few through-hole parts. But his layout planned that the holes weren't going to be plated through and used "z-wires" to connect traces top-to-bottom where needed. Using wire-wrap sockets for ICs allowed the sockets to be spaced up off the board for top-side soldering. Also impressive is the ease with which a board can be made. If something doesn't work out right, you can just change it and make a new board with a turn-around time of a couple of hours. Karl At 17:02 6/10/2000 -0700, you wrote: >Hi Karl, > >There is very little advantage in making double sided boards unless you can >make them through-hole plated. It is impossible to get some devices properly >connected to the runs under them. What is important about your information >is the resolution achieved. With good resolution you can use the process >perfected by the Japanese where you use a high resolution layout on one side >and wire jumpers on the other. There are board fab houses that will make >double __________________________________________________________ Public Seismic Network Mailing List (PSN-L)
Larry Cochrane <cochrane@..............>