Randy,

The main difference I can see is that the spring is stressed close to 
200 kPSI whereas the other mechanical parts, aren't.   With that much 
stress, things apparently need to sort out.

If Dave removes an aged spring and then reinstalls it, there are few 
pops.  If he accidentally installs it bent the other way there are 
again, many and it must be aged/baked again.

Brett

At 10:23 AM 9/27/2012, you wrote:
>Greetings,
>
>It occurs to me that some of the same defect structure Randall 
>speaks of would also occur in electronic components.  A capacitive 
>plate for instance has finite dimension and spacing but any edge or 
>surface defect provides a non-linearity with any expansion or 
>contraction of the plate or the dielectric.  A defect migration on 
>the surface would also alter the result.  A solution in my opinion 
>would be a multiple sensor configuration with internal function 
>similar to the method Brett and others use to measure noise levels 
>between two instruments by computing a coherent and a noise signal 
>for each.   Depending on the numbers of sensors in the box so to 
>speak the computed coherent output would have a statistical confidence level.
>
>Randy
>


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